Intellectual Property India Publishes Patent Application for Electrically Insulating Cover, Touch Protected Interface, High Voltage Module Connector And Kit

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202541009098 A) filed by Te Connectivity Solutions Gmbh on February 04, 2025, for Electrically Insulating Cover, Touch Protected Interface, High Voltage Module Connector And Kit.

Inventors include Eheim, Manuel; Schengel, Elina; Fissore, Luciano; Kaehny, Frank; Buchholz, Ron; Hoffmann, Bjoern; Distler, Patrick; Wolf, Marcus; Schaefer, Maik; Toth, Gerzson; and Nirmale, Mayur.

The application for the patent was published on August 07, 2026, under issue no. 32/2026.

Abstract: An electrically insulating cover (1) for a connection part (16) of an electrical module connector (2) comprises a housing section (40) that forms a protective collar (42) for the ...