MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202617089744 A) filed by Qualcomm Incorporated on July 23, 2026, for Downlink Communication With Downlink Grant And Uplink Grant.
Inventors include Yang, Luanxia; Wu, Zhikun; Liu, Le; and Gupta, Piyush.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, an ambient internet-of-things (A-IoT) device may receive a downlink communication with an uplink grant and a downlink grant. The A-IoT device may transmit an uplink communication based at least in part on the uplink grant. Numerous other aspects are ...