Intellectual Property India Publishes Patent Application for Dough Flattening Apparatus With Integrated Flour Dispensing And Method Of Operation

MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202641080889 A) filed by Aditya University; Aditya College Of Engineering And Technology A; Aditya College Of Pharmacy A; and Aditya Degree College on June 30, 2026, for Dough Flattening Apparatus With Integrated Flour Dispensing And Method Of Operation.

Inventors include Dr. Gowripattapu Sridevi; Mylavarapu Sarat Chandra Prasad; Gummarekula Satti Babu; Siriki Thirumala Devi; and Dr. Krishna Babu Sambaru.

The application for the patent was published on July 03, 2026, under issue no. 27/2026.

Abstract: The present disclosure proposes a dough flattening apparatus (100) configured to progressively flatten dough (10) to a predetermined thickness through ...