Intellectual Property India Publishes Patent Application for Devices Including One Or More High-Impedance Layers Between A Display Stack And An Ultrasonic Fingerprint Sensor Stack

MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202647068049 A) filed by Qualcomm Incorporated on May 30, 2026, for Devices Including One Or More High-Impedance Layers Between A Display Stack And An Ultrasonic Fingerprint Sensor Stack.

Inventors include Strohmann, Jessica Liu; Lin, Shiang-Chi; Li, Shaojui; Liu, Hsiang-Chi; Yang, Chia-Wei; Seo, Jae Hyeong; and Djordjev, Kostadin Dimitrov.

The application for the patent was published on June 05, 2026, under issue no. 23/2026.

Abstract: An apparatus may include a display stack, an ultrasonic sensor stack and a high-impedance stack including one or more high-impedance layers. The ultrasonic sensor stack may include an ultrasonic transceiver layer and...