Intellectual Property India Publishes Patent Application for Device With Side-By-Side Integrated Circuit Devices

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094320 A) filed by Qualcomm Incorporated on August 04, 2026, for Device With Side-By-Side Integrated Circuit Devices.

Inventors include Buot, Joan, Rey, Villarba; We, Hong, Bok; Wang, Zhijie; and Lee, Sang-Jae.

The application for the patent was published on August 07, 2026, under issue no. 32/2026.

Abstract: A device includes a substrate that includes a first layer stack including metal and dielectric layers. A first metal layer includes first contacts disposed in a first region and to electrically connect to an IC device, via pads disposed in a second region offset along a first direction, and traces electrically connecting the first contact...