Intellectual Property India Publishes Patent Application for Device Comprising Wall Pillar Interconnects

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647125417 A) filed by Qualcomm Incorporated on October 21, 2026, for Device Comprising Wall Pillar Interconnects.

Inventors include Chen, Yujen; Patil, Aniket; and Wang, Zhijie.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: A package comprising a substrate and a passive device coupled to the substrate through a plurality of solder interconnects. The substrate comprises at least one dielectric layer; and a plurality of interconnects. The passive device comprises a die substrate; a plurality of under bump metallization interconnects; and a plurality of pillar interconnects coupled to the plurali...