MUMBAI, India, June 19 -- Intellectual Property India has published a patent application (202617055490 A) filed by Robert Bosch Gmbh on April 30, 2026, for Device Comprising A Heat Sink And A Power Module.
Inventors include Kaltenecker, Soeren; and Stehlik, Daniel Michael.
The application for the patent was published on June 05, 2026, under issue no. 23/2026.
Abstract: The invention relates to a device comprising a heat sink (10) having a heat sink top side (11) and a power module (40) having a module underside (42), wherein the power module (40) is secured to the heat sink (10), wherein the module underside (42) faces the heat sink top side (11), wherein a solder layer (30) and a coating (20) are arranged between the power module (40) a...