MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617063232 A) filed by Tcnv, LLC on May 19, 2026, for Cylindrical Brush With Varying Brush Nodule Length.
Inventors include Benson, Briant; Dobbins, Michael; Cooper, Brian; Ottman, David; and Nesmiyan, Maxim.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The present invention provides a cylindrical brush assembly designed for precision cleaning of circular wafers and delicate surfaces. The brush features polyvinyl alcohol (PVA) nodules of varying lengths along one side of a cylindrical core, enabling conformity to changing gap sizes when applied at an angle to the wafer. This ensures consistent c...