MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617083023 A) filed by Tanaka Electronics Co. , Ltd. on July 06, 2026, for Copper Bonding Ribbon, Method For Manufacturing Copper Bonding Ribbon, And Semiconductor Device.
Inventors include Matsuzawa Osamu; Mitoma Shuichi; Murata Keisuke; and Matsunaga Shizu.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: The purpose of the present invention is to provide a copper bonding ribbon capable of securing bonding strength without damaging an object to be bonded, extending the life of the cutter, reducing electric conductivity, and suppressing oxidation progress of the surface of the copper ribbon. This...