MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127190 A) filed by Dowa Metaltech Co. , Ltd. on October 26, 2026, for Copper Alloy Sheet Material, Current-Carrying Component, Heat Dissipation Component, And Board- To-Board Connector.
Inventor includes Hyodo Hiroshi.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: Provided is a copper alloy sheet material having a chemical composition of, in mass%, Ni: 0.1-5.0%, Sn: 0.1-5.0%, and P: 0.01-0.5%, which may contain certain optional elements, with the balance being Cu and unavoidable impurities. In measurement at a step size of 0.1 µm by EBSD, the average crystal grain size by the area fraction ...