MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202647072469 A) filed by Hewlett-Packard Development Company, L. P. on June 11, 2026, for Cooling Device For A System-On-Chip.
Inventors include Chen, Chien-Hua; Cumbie, Michael W.; and Groom, Michael.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: A cooling device for a system-on-chip includes a plurality of cooling units including a first side to be coupled to a system-on-chip, each cooling unit spaced apart from the other cooling units to define a gap between adjacent cooling units, and an interposer coupled to a second side of the plurality of cooling units, the interposer including a flexible j...