MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617096411 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on August 10, 2026, for Contact Assembly And Relay.
Inventors include Dai, Wenguang; Wang, Meng; Chen, Songsheng; and Su, Liji.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present application relates to the technical field of electronic control devices, in particular to a contact assembly and a relay. The contact assembly comprises: a moving spring and a stationary contact set, wherein two ends of the moving spring can move relative to the stationary contact set so as to make contact with or disengage from the station...