MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202644034675 A) filed by Te Connectivity Solutions Gmbh on March 23, 2026, for Contact Assembly, Contact Bundle And Plugging Device.
Inventors include Heller, Christian; Raab, Stefan; Braun, Stefan; and Kraenzlein, Harald.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: The invention relates to a contact assembly (1) for a plugging device (2) of a charger, wherein the contact assembly (1) is configured to be held in the plugging device (2) and to be contacted by a mating contact (6) of the charger, wherein the contact assembly (1) comprises an electrically conductive contact element (8) and a h...