MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202527105819 A) filed by Dexerials Corporation on November 01, 2025, for Conductive Adhesive Film, Method For Manufacturing Conductive Adhesive Film, Connection Body, And Method For Manufacturing Connection Body.
Inventors include Shinohara, Seiichiro; and Tanaka, Yusuke.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: Provided is an conductive adhesive film that can efficiently use conductive particles, supports the miniaturization of the electrode size of an electronic component and fine pitch conversion thereof, and can ensure conduction reliability between connection electrodes and insulation per...