MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202617075162 A) filed by Plasma Innovations Gmbh on June 17, 2026, for Composite Material For Manufacturing Printed Circuit Boards, And Manufacturing Method.
Inventors include Bisges, Michael; and Henze, Enno Klaus.
The application for the patent was published on September 18, 2026, under issue no. 38/2026.
Abstract: The invention relates to a composite material for manufacturing printed circuit boards, offering advantages in terms of cost, weight, and availability compared to the conventionally used copper-clad laminate (CCL), the composite material comprising: - a planar carrier having a first and a second side, at least the two sides consisting ...