Intellectual Property India Publishes Patent Application for Coaxial-Annular Through-Glass Via Structure For Three-Dimensional Integrated Circuits, Methods Of Fabrication, Characterization & Design Thereof

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202611070915 A) filed by National Institute Of Technology, Hamirpur on June 08, 2026, for Coaxial-Annular Through-Glass Via Structure For Three-Dimensional Integrated Circuits, Methods Of Fabrication, Characterization & Design Thereof.

Inventors include Rohit Dhiman; K. Madhu Kiran; Suyash Sachdeva; and Rajeevan Chandel.

The application for the patent was published on August 07, 2026, under issue no. 32/2026.

Abstract: A coaxial-annular through-glass via (CoA-TGV) structure (100) for 3D ICs comprises a glass substrate having a via opening, an annular signal conductor (120) disposed within the via opening as a composite annular structure with inner a...