MUMBAI, India, Nov. 6 -- Intellectual Property India has published a patent application (202641129444 A) filed by Bapatla Surendra; and Irukumalli Priyanka on October 29, 2026, for Circuit Board Heat Pipe Sealed And Charged During Reflow By Solder-Locked Breakable Fluid Reservoir.
Inventors include Bapatla Surendra; and Irukumalli Priyanka.
The application for the patent was published on November 06, 2026, under issue no. 45/2026.
Abstract: CIRCUIT BOARD HEAT PIPE SEALED AND CHARGED DURING REFLOW BY SOLDER-LOCKED BREAKABLE FLUID RESERVOIR A heat pipe inside a circuit board for cooling components is sealed and filled during reflow soldering, without a separate filling station. A laminated board (102) has a cavity (114) with an aluminium t...