MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202647080388 A) filed by Henkel AG & Co. Kgaa on June 30, 2026, for Bonded Structure Comprising An Electrochemically Debondable Film Adhesive.
Inventors include Stapf, Stefanie; Stricker, Lucas; Tao, Fangqi; Kundt, Matthias Number; Goethel, Frank; Negele, Carla; Branagan, David; and Sweeney, Nigel.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: A bonded structure comprising: a first substrate provided with a first electrically conductive surface; a second substrate provided with a second electrically conductive surface; and, a cured, electrochemically debondable film adhesive interposed between said ...