MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202631086067 A) filed by Adamas University on July 14, 2026, for Biodegradable Hydrogel-Based Encapsulation Bead Composition And Preparation Method Thereof.
Inventors include Dr. Bandana Padhan; Dr. Joyjyoti Das; Ms. Parswati Sen; and Dr. Kartik Charan Lenka.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: ABSTRACT Disclosed herein is a composition (100) for biodegradable hydrogel-based encapsulation bead, the composition (100) comprises a hydrogel-forming biopolymer (102) present in 1% to 5% w/v and forms a hydrogel network and facilitates ionotropic gelation during bead formation, a polysaccharid...