MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202641087812 A) filed by Dr. R. Kumutha; and Sri Venkateswara College Of Engineering on July 17, 2026, for Bamboo Reinforced Composite Panels With Enhanced Insulation And Mechanical Properties.
Inventors include R. Rekha; S. Mohana Priya; and V. Giridharan.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The construction industry is becoming more focused on finding sustainable and cost-efficient materials for environmentally friendly building practices. Bamboo- embedded composite panels made with fibre-reinforced mortar is proposed for use in affordable housing. Different mortar mixtures, strengthene...