MUMBAI, India, Oct. 12 -- Intellectual Property India has published a patent application (202621102699 A) filed by Gokul Global University on August 25, 2026, for Automated Stuffed Bun Preparation Device.

Inventors include Dr. Chetanaba G. Rajput; Dr. Vipulkumar M. Dabhi; Aditi D. Raval; and Mayur Prajapati.

The application for the patent was published on October 09, 2026, under issue no. 41/2026.

Abstract: An automated stuffed bun preparation device, comprising a platform 101, a dough dispensing unit to dispense a flattened dough disc onto the platform 101, a filling dispensing unit to dispense a predetermined amount of filling onto the flattened dough disc, a bun shaping unit, configured to enclose the flattened dough disc and the fill...