MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088615 A) filed by Leybold Dresden Gmbh on July 21, 2026, for Attachment Mechanism For Two-Stage Cold Head.
Inventors include Kossev, Iordan; Nuetzel, Richard; and Hampel, Michael.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: An attachment mechanism for connecting a first stage displacer of a two-stage cold head to a second stage displacer of the two-stage cold head. The attachment mechanism comprises a plug that is attachable to an end of the first stage displacer. The plug comprises a recess for receiving an end of the second stage displacer. The attachment mechanism further comprises a ho...