MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617062917 A) filed by Aperam on May 18, 2026, for Assembly And Method For Cutting A Tie By Means Of A Remote Laser.
Inventors include Latouche, Baptiste, Pierre, Jean; Guillotte, Ismal, Romaric, Alexis; Diet, Francis, Jean, Dominique; and Bardet, Eric, Jules, Andr.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The invention relates a cutting assembly (10) for cutting at least one tie (6) surrounding a product (8), the cutting assembly (10) comprising: - a cutting unit (12), configured to emit laser beams (15) focused on the tie (6); - a control unit (14), configured to detect the presence of the...