Intellectual Property India Publishes Patent Application for Assemblies And Methods For Cooling And Heating Components In An Outdoor Conduction Cooled Clamshell Network System

MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202541040909 A) filed by Ciena Corporation on April 28, 2025, for Assemblies And Methods For Cooling And Heating Components In An Outdoor Conduction Cooled Clamshell Network System.

Inventors include Ranjeet Chaurasiya; Rampratap Mahawar; Shubham Kumar; Chander Prakash Gupta; Suyash Agrawal; and Mukul Tripathi.

The application for the patent was published on October 30, 2026, under issue no. 44/2026.

Abstract: A thermal management assembly including a cage adapted to receive a pluggable optical module, an evaporator plate disposed adjacent to and in thermal communication with one side of the cage and the pluggable optical module when received in the ...