MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202614002230 A) filed by Bhler Wafer Solutions on January 08, 2026, for Arrangement, Baking Oven And Method For Producing Wafers.
Inventors include Kalss, Georg; Miller, Karl; and Steinbck, Michael.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: Method, arrangement and baking oven for producing wafers in heated overpressure baking moulds (2) conveyed through the baking oven on an endless conveyor (20), comprising: - a baking plate (3) having a baking surface (4) on one of its sides for delimiting one of the overpressure baking moulds and a back surface (5) on its opposite side, - and an induction he...