MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202617043124 A) filed by Uacj Corporation on April 04, 2026, for Aluminum Alloy Structure, Thermal Bonding Method, And Aluminum Alloy Extruded Material And Method For Producing Same.
Inventors include Tomori Ryo; Suzuki Taichi; and Nakagawa Ryogo.
The application for the patent was published on June 19, 2026, under issue no. 25/2026.
Abstract: Disclosed is an aluminum alloy structure which is obtained by thermally bonding one member to be bonded and the other member to be bonded, the aluminum alloy structure being characterized in that: the one member to be bonded contains 1.80-3.00 mass% of Si, 0.10-1.60 mass% of Mn, and 0.01-0.70 mass% of Fe, with...