MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641051220 A) filed by Dr. A. Arun Negemiya; S. Naga Prasad; N. Mohamed Rizwan; S. Shanmugaraj; and Y. K. Siva Saveen on April 22, 2026, for Additively Manufactured Aluminium Sandwich Deck Plate With Integrated Heatpipe Cooling.
Inventors include Dr. A. Arun Negemiya; S. Naga Prasad; N. Mohamed Rizwan; S. Shanmugaraj; and Y. K. Siva Saveen.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: A novel additively manufactured aluminum sandwich deck plate with integrated heatpipe-based cooling is disclosed for aerospace avionics applications. The structure consists of aluminum face sheets and a lattice cor...