Intellectual Property India Publishes Patent Application for A Wire Arc Additive Manufacturing (waam) Process For Ultrasonic Vibration-Assisted Liquid-Based Cooling System And The System To Ensure Efficient Thermal Management

MUMBAI, India, Nov. 6 -- Intellectual Property India has published a patent application (202531098712 A) filed by Indian Institute Of Technology Indian School Of on October 13, 2025, for A Wire Arc Additive Manufacturing (waam) Process For Ultrasonic Vibration-Assisted Liquid-Based Cooling System And The System To Ensure Efficient Thermal Management.

Inventors include Ankit Raj; Raushan Kumar; Peeraj Majumder; and Alok Kumar Das.

The application for the patent was published on November 06, 2026, under issue no. 45/2026.

Abstract: The proposed Wire arc additive manufacturing (WAAM) process for Ultrasonic vibration-assisted liquid-based cooling system and the system for in situ cooling offers a promising hybrid approach for robotic WAAM pr...