MUMBAI, India, Oct. 19 -- Intellectual Property India has published a patent application (202647121097 A) filed by Henkel AG & Co. Kgaa on October 09, 2026, for A Thermally Debondable, Non-Reactive Heat Activated Adhesive Composition.
Inventors include Franken, Uwe; Heida, Thomas; Gutsche, Nadine; and Bergmann, Sophie.
The application for the patent was published on October 16, 2026, under issue no. 42/2026.
Abstract: The present invention relates to use of thermally debondable, non-reactive heat activated adhesive composition or thermally settled product according to present invention in a bonded structure, wherein the bonded are for example automotive components.
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