MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202621048527 A) filed by Electronics Devices Worldwide Private Limited on April 16, 2026, for A System With A Novel Coil Head And A Novel Tank Circuit For High–speed Induction Sealing Of Containers.

Inventors include Arun Kumar Paul; Sandeep Chinoy; Bikram Nahak; and Dhananjay Giri.

The application for the patent was published on July 03, 2026, under issue no. 27/2026.

Abstract: The present invention proposes a set of double layer or multilayer coil segments to boost the power transfer to the foil when the coupling coefficient between the coil and the foil is not large. In situations where the foil is placed near a coil, the magnetic field from the c...