MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202541073259 A) filed by Shereena P Joy; and Aryamaan Singh on August 01, 2025, for A Process For Making Biodegradable Printed Circuit Board Sheet.
Inventors include Shereena P Joy; Prasana Manikanda Kartik; and Aryamaan Singh.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: A process to make copper cladded or 3D printed eco-friendly conductive ink circuit biodegradable PCB sheet. The PCB sheet can be easily composted after its utility diminishes or reaches its maximum number of cycles. The said biodegradable PCB sheet is made from waste by-products promoting circular economy, further the said biod...