Intellectual Property India Publishes Patent Application for A Pcb Module Assembly For Better Heat Dissipation

MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202511002960 A) filed by Lumax Industries Limited on January 13, 2025, for A Pcb Module Assembly For Better Heat Dissipation.

Inventors include Sharma; Sanjeev.

The application for the patent was published on July 31, 2026, under issue no. 31/2026.

Abstract: A PCB MODULE ASSEMBLY FOR BETTER HEAT DISSIPATION ABSTRACT The PCB module assembly including stacked metalcore PCB for effective heat management in an electronic assembly includes a PCB that has a metal (aluminium) core/aluminium plate with mounting holes which forms the base wherein the other components are mounted such as finger heatsink ribs present at the end bend at an angle of 800-1000 to ...