MUMBAI, India, Sept. 28 -- Intellectual Property India has published a patent application (202621096506 A) filed by Econovus Packaging Private Limited on August 10, 2026, for A Pallet-Less Packaging System For Transportation Of Automotive And Industrial Components.
Inventor includes Prasad, Ramesh.
The application for the patent was published on September 25, 2026, under issue no. 39/2026.
Abstract: A pallet-less packaging system (100) for transportation of automotive and industrial components comprises a base structure (102) incorporating center of gravity (CG) runners (104) integrated directly into the bottom of the base structure (102) to enable forklift and material handling operations without an independent pallet. A removable sleev...