Intellectual Property India Publishes Patent Application for A Novel Extrusion System Attachment For Robot-Based Soil 3d Printing

MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202521031603 A) filed by Avadhoot Umakant Rajurkar; and Girish Narayan Kotwal on March 31, 2025, for A Novel Extrusion System Attachment For Robot-Based Soil 3d Printing.

Inventors include Avadhoot Umakant Rajurkar; and Girish Narayan Kotwal.

The application for the patent was published on October 02, 2026, under issue no. 40/2026.

Abstract: This patent describes a soil 3D printing design with an extrusion mechanism designed for mounting on industrial robotic arms. The design enables precise movement and positioning during the printing process. The setup comprises housing for encasing as well as supporting components of the extrusion mechanism. Furth...