MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617097074 A) filed by Nanize As on August 11, 2026, for A Method Of Rapid Curing With Energized Curing Vapour And A Substrate Produced By The Method.
Inventors include Iwu, Kingsley Odinaka; and Nwamma, Macdonald Elochukwu.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present invention relates to a method of curing a layer of a coating formulation deposited on a substrate, the coating formulation containing hydrolysable Si-X groups wherein X is selected from a halogen, C1-C6 alkoxy, hydrogen, -NH-Si or -NH2: The method comprising the steps of energizing a curing vapour, and subjecting the...