Intellectual Property India Publishes Patent Application for A Heat Sink Assembly With Improved Fin Arrangements For Effective Heat Dissipation

MUMBAI, India, Sept. 22 -- Intellectual Property India has published a patent application (202541022328 A) filed by Stellantis Auto Sas; and Fca Us LLC on March 12, 2025, for A Heat Sink Assembly With Improved Fin Arrangements For Effective Heat Dissipation.

Inventors include Shivaprasada Kv; Ravinder Singh; Manish Kumar; and Naresh Dalal.

The application for the patent was published on September 18, 2026, under issue no. 38/2026.

Abstract: A heat sink assembly (100) for dissipating of heat from heat generating areas of a circuit board (105). The heat sink assembly (100) includes a top cover (101); a bottom cover (103) is fixed with the top cover (101), and a plurality of fins (104) configured to dissipate the heat from the heat generati...