Intellectual Property India Publishes Patent Application for A Die-To-Die Interface Coupled Between A Virtual Phy And Virtual Mac

MUMBAI, India, Sept. 14 -- Intellectual Property India has published a patent application (202617069191 A) filed by Kandou Labs Sa on June 02, 2026, for A Die-To-Die Interface Coupled Between A Virtual Phy And Virtual Mac.

Inventors include Korger, Peter; Koch, Alexander; and Perrin, Victor.

The application for the patent was published on September 11, 2026, under issue no. 37/2026.

Abstract: A virtualised PHY (V-PHY) Interface for the PCI Express protocol is provided to enable a first PIPE-compliant component located on a first circuit die to communicate with a second PIPE-compliant component located on a second circuit die, where the first and second circuit dies are communicatively coupled to one another via a die- to-die (D2D) interf...