MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202514040942 A) filed by E-Lead Electronic Co. Ltd., Changhua, Taiwan, on April 28, 2025, for 'wireless charging device with heat dissipation structure.'
Inventor(s) include Stephen, Hsi-Hsun, Chen.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "A wireless charging device with a heat dissipation structure comprises a first housing and a second housing that are mutually combined. The first housing includes at least one charging pad, at least one intake grille, and at least one exhaust assembly. The at least one charging pad protrudes from an o...