MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202544097757 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on Oct. 10, 2025, for 'vehicular antenna having a low-profile antenna assembly for non-metal surface and metal surface application.'
Inventor(s) include Ng, Kokjiunn; Tan, Poi Ngee; Lee, Tinghee; and Lim, Keanmeng.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "A vehicular antenna includes a low-profile housing (110) having a first end and a second end and having a first side and a second side. An antenna assembly (200) is provided in the low-profile housing. ...