Intellectual Property India Publishes Patent Application for 'Telecommunications Socket Dust Cover And Telecommunications Socket Panel' Filed by Emplus Technologies, Inc.

MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202414044611 A) filed by Emplus Technologies, Inc., Taipei City, Taiwan, on June 10, 2024, for 'telecommunications socket dust cover and telecommunications socket panel.'

Inventor(s) include Hung-Wei Liao.

The application for the patent was published on Oct. 31, under issue no. 44/2025.

According to the abstract released by the Intellectual Property India: "A telecommunications socket dust cover and a telecommunications socket panel are provided. The telecommunications socket dust cover includes a cover body, at least one wedge-shaped body and a groove. The at least one wedge-shaped body is disposed at a top end of the cover body and includes an inc...