Intellectual Property India Publishes Patent Application for 'Sustainable High-Density Mobile Memory Chip Employing Tin Vias, Biopolymer Substrate, And Hybrid Die Stacking' Filed by Kunaal Gadhalay

MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202621025664 A) filed by Kunaal Gadhalay, Aurangabad, Maharashtra, on March 4, for 'sustainable high-density mobile memory chip employing tin vias, biopolymer substrate, and hybrid die stacking.'

Inventor(s) include Kunaal Gadhalay.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "The invention discloses a mobile memory chip architecture employing tin-based vertical interconnects and a biodegradable biopolymer substrate reinforced with Si-TaN nanocrystals. The chip comprises a multi-layered structure with a bottom computing logic layer, interme...