Intellectual Property India Publishes Patent Application for 'Sub-Primal Cut Identification And Packaging Optimization System And Method' Filed by John Bean Technologies Corporation

MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517022442 A) filed by John Bean Technologies Corporation, Chicago, on March 12, for 'sub-primal cut identification and packaging optimization system and method.'

Inventor(s) include Blaine, George R; and Stockard, Richard D.

The application for the patent was published on May 30, under issue no. 22/2025.

According to the abstract released by the Intellectual Property India: "A method carried out by a computing device may include: receiving a plurality of models each associated with a type of sub-primal cut, including a reference shape(s) for detection of a corresponding match characteristic by a corresponding scan type, and including a plurality o...