MUMBAI, India, May 30 -- Intellectual Property India has published a patent application (202517044359 A) filed by Namics Corporation, Niigata, Japan, on May 7, for 'resin composition, adhesive, sealant, cured product and semiconductor device.'
Inventor(s) include Otsubo Kodai.
The application for the patent was published on May 30, under issue no. 22/2025.
According to the abstract released by the Intellectual Property India: "The object of the present invention is to provide a resin composition and an adhesive that can reduce odor derived from thiol curing agents and provide a cured product with reduced odor. The present invention provides a resin composition comprising (A) a thiol curing agent having two or more thiol groups, (B) a mai...