MUMBAI, India, Feb. 13 -- Intellectual Property India has published a patent application (202541126669 A) filed by Mepco Schlenk Engineering College; Dr. S. Surlya; Dr. M. Chellapandian; and N. Radhakrishnan, Sivakasi, Tamil Nadu, on Dec. 15, 2025, for 'proposing effective surface treatment techniques for light weight expanded clay aggregate.'
Inventor(s) include S. Surlya; M. Chellapandian; and N. Radhakrishnan.
The application for the patent was published on Feb. 13, under issue no. 07/2026.
According to the abstract released by the Intellectual Property India: "In the present scenario, repl"acing a portion of coarse aggregate with ceramic tile waste in paver block manufacturing advances importance due to environmental considerations a...