MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202517093227 A) filed by Ube Corporation, Yamaguchi, Japan, on Sept. 29, for 'polyamide resin composition, film and film laminate comprising same, and pellet mixture.'
Inventor(s) include Fujino Hiroshi; Ono Keitarou; Hanaoka Yasunari; and Yamashita Atsushi.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "Provided are: a polyamide resin composition, which can provide a film that does not have poor appearance arising from film gel and has excellent transparency, mechanical strength, and pinhole resistance and which makes material recycling possib...