MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202514071660 A) filed by Triple Win Technology (SHENZHEN) Co. Ltd., Shenzhen, China, on July 28, 2025, for 'photoelectric packaging structure, manufacturing method, and camera module.'
Inventor(s) include Hsin-Yen Hsu; Tzu-Li Feng; Hung-Ta Li; and Yi-Mou Huang.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "A photoelectric packaging structure, manufacturing method, and camera module are provided. The structure includes a plastic packaging module, a photosensitive chip, and a substrate module. The plastic packaging module includes a packaging ...