Intellectual Property India Publishes Patent Application for 'Packaging System' Filed by Owens Corning Intellectual Capital, Llc

MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202617014193 A) filed by Owens Corning Intellectual Capital, Llc, Toledo, U.S.A., on Feb. 10, for 'packaging system.'

Inventor(s) include Brandt, Luc; Dufresne, Elizabeth A; Graham, John William; Potrony, Francisco Fernndez; and Obrin, III, Steve John.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "A package includes discrete units of a fibrous material (e.g., fiberglass rovings, carbon tows) that are positioned in multiple layers on a pallet, with each layer of the fibrous material units having a separator plate supported over it. According ...