MUMBAI, India, Nov. 21 -- Intellectual Property India has published a patent application (202517097573 A) filed by Namics Corporation, Niigata, Japan, on Oct. 9, for 'novel acrylamide, composition containing same, curable composition, adhesive, sealing material, cured product, semiconductor device, and electronic component.'
Inventor(s) include Sato Ayako; and Iwaya Kazuki.
The application for the patent was published on Nov. 21, under issue no. 47/2025.
According to the abstract released by the Intellectual Property India: "The present invention addresses the problem of providing: a novel substance capable of solving the problem of conventional bismaleimides having a dimer acid skeleton; a curable composition, adhesive, or sealing mater...