Intellectual Property India Publishes Patent Application for 'Modular Package Opener' Filed by Chandigarh Group Of Colleges

MUMBAI, India, Nov. 14 -- Intellectual Property India has published a patent application (202411025538 A) filed by Chandigarh Group Of Colleges, Mohali, Punjab, on March 28, 2024, for 'modular package opener.'

Inventor(s) include Dr. Parveen Singla; Dr. Dinesh Arora; Dr. Ruchi Singla; Ritwika Raj; Nandita; and Onkar.

The application for the patent was published on Nov. 14, under issue no. 46/2025.

According to the abstract released by the Intellectual Property India: "A modular package opener comprises of a wearable body 1 having a hemisphere topped by a cylindrical member, a touch sensor installed in the body 1 for detecting the user's fingers in the body 1, an artificial intelligence-based imaging unit 2 installed on the body 1 to dete...