MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202537133010 A) filed by Kaneka Americas Holding, Inc., Pasadena, U.S.A., on Dec. 29, 2025, for 'method of preparing a moisture curable resin composition.'
Inventor(s) include Barrus, Jonathan; Nakagawa, Yoshiki; Wang, Ruolei; and Koya, Shota.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "A method for preparing a moisture curable resin composition includes combining at least one moisture curable resin and at least one plasticizer, thereby forming an initial mixture, removing moisture by mixing the initial mixture with a first dose of a dehyd...